Products

Polar Asia Pac in collaboration with Bogatin Enterprises LLC, USA can offer a comprehensive range of public classes and customised in-house training courses and programs to specifically suit your organisations human resources technical training needs.

Contact us for more details.

This two-day class, designed and offered by Signal Integrity Evangelist Dr. Eric Bogatin, shows you how to unlock the power of S-Parameters for signal integrity applications. This class enables you to tap into the secrets locked inside S-Parameters and walks through the details of interpreting the measured or simulated results of 1-port, 2-port, or 4-port S-Parameters as single ended, differential in the frequency domain and the time domain.

Download Course Details

This one-day class shows you how to design power distribution networks including board stack up, capacitor selection and mounting design. There are many myths associated with power integrity: just use 3 capacitors per pin, use as large a capacitor value as you can, stack capacitors on top of each other to get them closer to the device, or use short surface traces from the capacitor to the power pin. The way to separate myth from reality is by putting in the numbers. A key feature of this class is illustrating how to apply analysis tools such as rules of thumb, approximations, SPICE and 3D field solvers to provide guidance in achieving first time success. More..

Download Course Details.

High Speed communication link designs are becoming ever more challenging. The fast pace development of semiconductor and IC technology combined with the ever increasing data rates have added to the challenge. Xpeedic’s High Speed SI solutions provide a fast and accurate way to model and simulate the discontinuities along the path and optimize channel performance.
 
SnPExpert – SnpExpert provides a quick way to understand the electrical characteristics of the passive interconnectors in a system by not only viewing the S-parameter in frequency domain but also examining them in time domain (TDR).

ChannelExpert – ChannelExpert provides a fast and accurate way to address the signal integrity issues arising from cascaded network of S-parameter blocks and TML models. It’s frequency domain cascading technology and 2D-RLCG full wave transmission line solver enables quick and accurate channel simulation.

ViaExpert – ViaExpert provides a fast and accurate way to simulate via structures for both pre-layout and post-layout scenarios. The built-in connector footprint database allow users to quickly assemble the via model with connector footprint, breakout region trace, for a given stackup.  

Dr. Ransom Stephens, Ph.D. is the author of over three hundred articles in the electronics industry, science journals and magazines on subjects ranging from the analysis of electrodynamics in high rate digital systems to fiber optics to quantum physics. As a research physicist and professor, he worked on experiments at universities and laboratories across the US and Europe making precise measurements of messy signals.

After being awarded tenure, he shifted to private enterprise where his expertise in signal integrity analysis of electrical and fiber optic systems. Led to new jitter measurement techniques and methods for extracting signals from noise. He has served on the electrical working groups for several high data rate standards including PCIe and OIF CEI. Ransom is an entertaining teacher with a legendary reputation for delivering a clear understanding of complex topics. 

Find out more here.

Atlas for Anritsu VNA is compliant with IPC TM650 2.5.5.12 (Test Methods to determine the Amount of Signal Loss on Printed Boards) and provides support for Delta-L methodology.

Atlas Si is a high precision insertion loss measurement package designed specifically for PCB fabricators and OEMs. It provides accurate, repeatable measurements of frequency-based transmission line losses, allowing fabricators to meet stringent targets that maintain signal integrity within the limits of the latest high-speed chipsets.

Polar has partnered Anritsu for integrating their Anritsu ShockLine™ 4-Port Performance VNA (vector network analyzers) with Atlas. Anritsu ShockLine™ 4-Port Performance VNAs achieve a new level of capability, flexibility, and value for RF and microwave network analysis applications delivering excellent performance for measurements from 50 kHz up to 43.5 GHz. These instruments are ideal for testing passive and many active components with general purpose VNA requirements. The ShockLine family employs advanced Anritsu technology and design expertise to attain outstanding dynamic range, calibration and measurement stability, and speed performance in efficiently packaged, compact, and robust VNA instruments.

Anritsu ShockLine™ 4-Port Performance VNA Key Features and Benefits

• Time domain with time gating option enables easier and faster fault identification in broadband devices
• Patented non-linear transmission line (NLTL) technology delivers wider bandwidth and higher dynamic range than competing technologies, enabling better measurement accuracy and repeatability with longer intervals between calibrations
• Multiple calibration methods to choose from to best suit your application – SOLT, SOLR, SSLT, SSST, LRL, LRM, or Thru update
• Precision AutoCal™ or SmartCal™ for an easy, one-button automatic method of VNA calibration
• Eliminates the need for over-specified, high-end VNAs with extra features not required for production testing
• Anritsu’s Extended-K^TM connectors enable ShockLine frequency option 43 VNAs to offer guaranteed performance to 43.5 GHz in a K/2.92 mm compatible form factor

Download Brochure

_{Note: Anritsu Corp., USA are the sole owners of following trade marks for ShockLine™, AutoCal™, SmartCal™ and Extended-K^TM}

• Fundamentals of transmission lines
• Controlled impedance design and simulation
• Multi-layered stackup design
• TDR test methodology
• IST design test methodology
• High speed design and test methodology

Contact Us for more details.

Polar Atlas software enables PCB fabricators to test PCB transmission line losses in a tightly controlled production environment. Atlas employs mathematical processing techniques* to extract frequency dependent loss characteristics when used in conjunction with suitably designed test coupons and Atlas precision GHz probe assemblies.

Atlas packages interface either with industry standard Tektronix DSA8300 or DSA8200 oscilloscope TDRs. Fabricators can choose to add Atlas to their existing Tek DSA or alternatively Polar can supply a turnkey package.

Atlas supports multiple test methods including Delta-L, Delta-L 3 Line, SET2DIL (Single-Ended TDR to Differential Insertion Loss) for extraction of differential insertion loss and effective Er from a single ended test and suitably designed coupon, SET2SEIL method (Single-Ended TDR to Single-Ended Insertion Loss) for single ended insertion loss testing and SPP (Short Pulse Propagation) methods as called for in IPC-TM-650

Main Features

• Atlas software is designed to assist PCB fabricators in the accurate and repeatable measurement of PCB transmission line losses in a PCB production environment.
• Ergonomic probe housing:
•  Tracks system risetime and monitors the system bandwidth.
• Delta-L - Atlas supports the Delta-L technique (v16_04 fully incorporates rev2p31 of Delta-L with the current settings and parameters) which uses long-line short-line measurement combined with innovative via de-embedding techniques, Delta-L provides a sound method for removing the via effects from differential (mixed mode) s-parameters when characterizing raw PCBs for insertion loss.
• SET2DIL/SET2SEIL - Atlas test methods also include both the SET2DIL (Single-Ended TDR to Differential Insertion Loss) and SET2SEIL (Single-Ended TDR to Single-Ended Insertion Loss) test methods for extracting differential insertion loss from single ended measurements.
• SPP – Short Pulse Propagation  - SPP allows extraction of PCB electrical characteristics that impact signal propagation; it uses your existing TDR/TDT equipment and produces frequency dependent parameters such as the propagation constant (alpha, attenuation and beta, phase constant) and effective dielectric constant along with the characteristic impedance (including even and odd mode impedance.) Atlas measurements include launch point extrapolation/long line regression fit.
• Controlled impedance test - Atlas GHz test software is also capable of traditional lossless controlled impedance test

Download Brochure

The DVS550 is an automated prober for measurements replacing the previously time-consuming procedure carried out manually. A highly flexible, low loss coaxial cable feeds the signal at the probe tip to a variety of test and measurement equipment such as High-Speed Oscilloscopes, Spectrum Analyzers or Time Domain Reflectometers. It has options to control external hardware via USB, Ethernet, GPIB, RS232.

The DVS550 can test and document measurements on hundreds of nets in less than a few hours while manual measurements would take weeks of valuable engineering time. The DVS550 System has been designed for measuring signal frequencies into the GHz range using custom designed coaxial probing technology contrasting significantly conventional Flying Probe Systems with a focus on detecting typical manufacturing faults.

Download DVS550 brochure

The Si8000m is a boundary element method field solver that builds on the familiar easy to use user interface in earlier Polar impedance design systems. The Si8000m adds enhanced modelling to predict the finished impedance of multiple dielectric PCB builds and takes into account the local variations in dielectric constant on close spaced differential structures. The Si8000m assumes negligible insertion loss in the transmission line. The Si8000m field solving impedance design system offers advanced field solving methods to model most circuit designs and is totally complementary to the CITS880s and RITS550/880 manual and automatic Controlled Impedance Test Systems.

Main Features

• Powerful impedance design system
• Impedance Goal seeking
• Model multiple dielectric PCBs
• 16 Single ended structures
• 27 Differential structures
• 36 Single ended coplanar structures
• 36 Differential coplanar structures
• Reduce time to market
• Graph production variations
• Single ended and differential modelling
• Calculate the effect of resin rich areas
• Enhanced soldermask models
• Optional track resistance calculator

Si8000m options

• XFE option – provides crosshatch return path modelling for flex and flex-rigid PCBs
• Si Crosstalk option – Multi line and differential pair (lossless) crosstalk – models coupling between traces
• Si Excel Interface option – Microsoft Excel® interface option for lossless calculations in Si8000m/Si9000e
• Projects option with Speedstack saves structure groups

Download Si8000m Brochure

CITS880s system is the 9th generation impedance test system from Polar Instruments Ltd, UK. It is a solution for fabricators who need to measure impedance on fine traces and thin copper. CITS880s features Launch Point Extrapolation (LPE) that extrapolates the TDR response to a point close to the start of the transmission line effectively aloowing users to measure the instantaneous or incident impedance of the line more acccurately.

In addition to the LPE the CITS880s is also capable of measuring shorter traces - typically 2-3 inches shorter than previous generation of the CITS series. CITS880s now ships with completely re-engineered IPS and IPDS high speed probes whcih reassuringly are precision moulded with ESD dissipative materials to give maximum protection to your CITS.

Polar IPS and IPDS high speed probes are specifically desgined for CITS880s. They combine revised internals with more robust mechanical design and enhancements to the signal path, along with ergonomic precision mouldings in 100% ESD dissipative materials. IPS and IPDS probes are easily identified and contrast with previous generation probes by the use of the blue labels and blue resists on the probe tip interface.

Click here to see what's new in the CITS880s.

Multi Job Panelizer is a stand-alone software application to combine different single PCBs into high-yield production panels. It optimizes base material utilization while minimizing the number of different panel layouts and production batches entering the shop floor. Its modular concept and scalability make it the perfect tool for interactive as well as for 24/7 fully automated and unattended use. Multi Job Panelizer blends in naturally with any existing CAM environment, whether from Ucamco-or from a third-party software supplier.

As an interactive tool, Multi Job Panelizer features an easy-to-use PCB placement interface, with neatly designed and intuitive function buttons, backed up by pleasant keyboard shortcuts. Various plug-ins for real-time panel analysis and optimization provide visual feedback during operation and guarantee unparalleled throughput and efficiency during the manual layout of a multi job production panel.

Download Brochure

Speedstack PCB stackup design tool is a packaged combination of the Si8000m field solving impedance calculator and the Speedstack professional layer PCB stackup design system. It allows both impedance calculation and layer stackup/build up documentation.

For PCB fabricators, Speedstack PCB interfaces with the industry standard Polar Si8000m PCB Controlled Impedance Field Solver. It includes a link and license for Polar’s Si8000m, using the proven Polar Si8000m multiple dielectric boundary element field solver to provide the impedance data for the stack.

Ideal for both rigid and flex-rigid stackups

Speedstack PCB allows OEM designers to create accurate and efficient rigid and flex-rigid PCB stackups in just a few minutes, with error-free documentation for tighter control over the finished board. For PCB fabricators, Speedstack PCB provides the flexibility to quickly calculate the impact of substituting alternative materials to improve manufacturability and reduce cost while maintaining the specified parameters and performance of the board. The Navigator provides a clear contextual view of the rigid and flexible stacks within a flex-rigid build and allows easy alignment of displayed materials between stacks.

Speedstack PCB can be used when modelling and documenting mesh/crosshatch ground. Structure data and mesh geometry can be readily shared between Speedstack and the field solver. The associated technical report also supports different materials on the same dielectric layer, improving the clarity of documentation between the stackup designer and fabricator.

Download Speedstack PCB Brochure

YELO can automatically adjust a layout for easier manufacturability. It can modify layouts like rearranging track bundles, shaving pads or reducing copper areas manually, cut down your CAM resources by hours. This offers the possibility to use different materials, shorten delivery times or make the PCB’s more reliable.

Main Features

• Significantly improve board layouts within minutes
• Cut back your CAM cycle time by up to 30%
• Achieve superior production yields
• Deliver more reliable PCBs
• Slash production cost on every batch

Download Brochure

RITS 550 automates the industry standard CITS880s (Controlled Impedance Test System) to give fast, repeatable volume testing of coupons and PCBs. The system is controlled via easy to use Windows software. Test set-up is straight forward, results data is automatically logged in accessible formats, and there is the option of a built-in report generator.

Accurate, traceable measurement RITS550 uses proven time domain reflectometry (TDR) techniques to measure the reflection of fast rise-time pulses. High precision reference airlines - traceable to NPL and NIST standards - ensure repeatable measurement accuracy to allow the trace impedances to be controlled.

With test times as fast as fixture-based systems, RITS550 flying probe technology provides unparalleled levels of measurement repeatability, with a lifetime cost of ownership that is just a fraction of a fixture-based system.

RITS880 is a built to order automated impedance measurement system which is larger version of the RITS550. It can incorporate full sized panels and can be equipped with an automatic loader/unloader to provide full automation for impedance testing.

Click here to download brochure for RITS550

Click here to download brochure for RITS880

Ihara Electronics Co. Ltd, Japan presents ACCULINE II a truly portable, light weight, battery operated, digital line width and spacing measurement system. ACCULINE's built in color LCD display allows operators to make quick, accurate and repeatable measurements for top and bottom line width and spacing for fine line single ended and differential controlled impedance traces.

ACCULINE II is a high performance and reliable product which utilizes advanced micro computer technology and color LCD image sensor to ensure superior performance and measurement reliability. It is a battery-operated tool offering a truly portable unit that makes operation easy at any location including dark rooms with low visibility. The large LCD displays real line images that can be transferred to a PC, using a USB port, for further analysis.

Usually operators rely on skill to make measurements using a microscope and this can result in varied results for different operators. ACCULINE's automated measurement algorithm provides accurate and repeatable results in its place.

Download ACCULINE Brochure

With more than 30 years of experience and knowledge CL Tech offer full range of Universal Grid Systems which allow flexibility in using most of the fixture models and data preparation available on the market. The system's tailor-made electronics provide it mechenical strength, speed and reliability.

Our universal grid machines are available with 2 technologies:

• Plug-In: Scanner board integrated in the test area.
• Wired: Scanner board connect to the test area with wires.

GT20-20 and Valid8 machines use the test board integrated in the test area, while Precise and Micro uses the wire connection toward the test area.

GT20-20 can be equipped with an automatic belt system for loading and unloading that can be installed on site. This allows the machine to reach a productivity up to 1.000 PCB/hour or with an automatic arm system with speed up to 450 PCB/hour. The available testing areas are 12.8” x 11.2” e 16.8” x 12.8” for any mentioned density. Other testing area configuration are available on demand.

Valid8 has maximum test area 19,2″ x 16″, for any density. Inferior and superior active area. It is a system developed for testing large PCB with a high number of test points like back planes, servers boards, mother boards, etc.

Precise is available with any grid step, even on clients request with the maximum test area at 24” x 20” and the number off test points at 48.000 (per test area).

Micro is available with a single or double density grid. The maximum test area is 365mm x 284mm (14,4″ x 11,2″) and the maximum number of test points is 32.256 (for test area).

Download G20 FLex Brochure

Download G20 Brochure

Download Valid8 Brochure

Download Valid8 Auto Brochure

SIMBEOR is a 3D electromagnetic signal integrity tool for simulating and analyzing the entire interconnect link. It offers an industry-first measurement-validated electromagnetic signal integrity software for the physical design of PCB and packaging interconnects for communication links operating at 6-112 Gb/s and beyond. Simbeor is the one-stop solution for all interconnect budget exploration (advanced stackup planning and pre-layout), design verification (post-layout), dielectric and conductor roughness models identification, and macro-modeling tasks. The accuracy of the models is ensured by the use of advanced algorithms for 3D full-wave analysis, benchmarking, and experimental validation. It fits any design flow as a system interconnect budget exploration tool, interconnect verification tool, or a Touchstone model clean-up and macro-modeling tool for automatic S parameter extraction.

Simbeor Solvers and Algorithms:

Simbeor 3DML™ : Full-wave 3D analysis tool for multi-layered geometries:

• Hybrid solver : Method of Lines + Trefftz Finite Elements + Method of Simultaneous Diagonalization (de-embedding)
• Analysis of discontinuities and transmission lines with high-frequency (non-TEM) dispersion and anisotropy (any planar cross-section)
• Simbeor 3DTF™ : First full-wave 3D analysis tool based on Trefftz Finite Elements (aka Ultra-Weak Discontinuous Galerkin's Wave Elements)

Simbeor SFS™ : Unique quasi-static field solver for large t-line cross-sections (any planar cross-section):

• MoM : Supports all dispersive isotropic material and conductor roughness models
• Linear Network solvers : Unique port-based circuit analysis with 7 solvers for frequency and time domain analyses of multiport networks based on Y or S-parameters (with sparse solvers for extremely large multiport networks), capabilities to extract GMS-parameters, test fixture S-parameters and de-embed test fixture
• Rational Compactor™ : Converts discrete S-parameter models into frequency-continuous rational macro-models for consistent frequency and time domain analyses

Simbeor : Tools and Interfaces:
Board Analyzer™ : Post-layout decompositional electromagnetic analysis
Transmission Line Wizard - Fast synthesis of any single-ended and differential line geometries (strip, microstrip, CPW, CBCPW)
Via Analyzer™ : Fast synthesis of via-holes and launches geometry
Touchstone Analyzer™ : S-parameters plotting, quality assurance, and rational macro-modeling
Geometry Editor : Pre and Post-layout analyses of multi-layered circuits
Linear Network Editor : Draw or edit multiport networks (link path models)
SiTune™ : Material models, geometry and linear network optimization
Board Geometry Translators : ODB++, HyperLynx hyp-file, Allegro brd/mcm, PADS ASCII
Violation Browser™ : Violation viewer for EMSAT rule checker
Eye Analyzer™ : Computation of eye diagram metrics and comparison of eye diagrams
ICN Analyzer™ : Computation of Integrated Crosstalk Noise and a quick comparison with compliance mask
Interactive Graphs : Plot transmission line modal and RLGC(f) parameters, S-parameters, 10G and 25G compliance metrics, TDR/TDT, eye diagram
Batch Mode - Run analysis in batch mode for design automation
 

Download SIMBEOR Brochure

Applicable only in Greater China, India, Vietnam, Malaysia, Thailand, and Singapore.

ChannelExpert provides a fast, accurate and easy way to evaluate and analyze pre-layout or post-layout high speed channel with its built-in advanced circuit and EM solver technologies.

It is challenging for digital system designers to simulate a high-speed SERDES channels. There are many different simulation scenarios to cover ranging from pre-layout / post-layout, frequency-domain / time-domain / statistical analysis, compliance check, to TX / RX optimization. 

ChannelExpert offers many built-in channel templates to support pre-layout exploration. Parametric S-parameters and transmission line models are supported for easy channel exploration. For post-layout scenario, ChannelExpert can extract the desired channels with or without crosstalk from physical layout with transmission line and 3D via models automatically generated with inbuilt field solvers.

Key Features

• Built-in 2D RLGC solver to model TML
• Easy multiple channel creation by table with only one-click
• Built-in template to quickly create single channel and multiple channel
• Easy to import PCB file to create channel
• Support full BP simulation for Traditional BP, Orthogonal Direct BP, Orthogonal Mid-Plane BP
• Support generating high speed SERDES channels from a bunch of PCB files and perform crosstalk and insertion loss simulations
• Support buffers with DFE, CTLE and FFE, automatically optimize the equalization coefficient based on channel characteristics
• Built-in substrate and stackup databases to modeling TML
• Parametric S-Parameter files and transmission line physical parameters for easy channel exploration
• Add multiple interpolation and extrapolation algorithms for S-parameter based frequency domain and crosstalk analysis
• Support COM (Channel operation margin) analysis
• Seamlessly link to SnpExpert for S-parameter viewing and post-processing

Download ChannelExpert Brochure

SCREEN Graphic and Precision Solutions Co. Ltd, is the leading manufacturer of Direct Imaging systems from Japan and has over 270 installations globally. LEDIA DI Direct Imaging system delivers field-proven high precision accuracy, reliability and throughput to PCB manufacturers with an estimated 70% market share amongst the largest global PCB manufacturers. LEDIA DI systems are now available in India exclusively through UCAMCO B.V, Belgium and Polar Instruments (Asia Pacific) Pte Ltd, Singapore. These systems are supported by Ucamco & Polar local network of highly skilled sales and support engineers.

3 simultaneous wavelengths
UV-LEDs with three wavelengths are now combined in the Ledia light source. The wave-length range from 350nm to 440nm enabling the energy diffuses optimally throughout the resist layer. The user can set each wavelengths power individually to achieve optimal imaging for resist or solder mask type. The result is high throughput and unrivalled quality that deliver 50µm solder mask dams without any noticeable undercut.

The combination of three wavelengths UV-LED allows different types of resists to be imaged using an optimal output ratio using wavelength modulation. Compared to a standard direct imaging system, the LEDIA enables manufacturers to pursue even higher imaging quality. The system supports cutting-edge technologies, including a high-precision auto-focus function and alignment algorithms that compensate for various types of substrate distortion. 

Low operational cost 
The adoption of UV-LED technology as a light source results in considerable lower consumable cost compared to conventional laser direct imaging systems. Also the LED’s are only active when physically imaging panels, resulting in an even longer LED life time.

Cost Cutting 

• No mask making costs.
• Rationalization of manpower by simplified mask manufacturing process.
• Enhanced production yields.
• Better Registration
• No repeat defects

Faster Delivery Times

• Shortened turnaround time achieved by simplified manufacturing.
• Easy and flexible process control.

High-Value added Product

• High precision and high accuracy patterns. 
• Easy management or control on individual board.
• Easy Operation. (For skill-Less Operator)

Highest productivity for solder mask
UV-LED technology in combination with multi wavelength LEDs delivers high throughput with the highest quality for your solder mask applications. The different wavelengths have peaks in both the absorbed and the transmitted wavelength areas of the spectrum of the solder mask inks. This allows even polymerization at the top as well as the bottom of the solder mask layer, resulting in a fully polymerized layer with optimal adhesion to the substrate.
 

Download Brochure

The Colenta NG - PCB Film Processor is a fully automatic “dry to dry” processing system designed to provide consistent high-quality film production for the range of PCB films commonly used in the industry. The processor design incorporates a non-opposed, submersed roller transport system with minimal contact to the film emulsion and with intermediate wash water crossovers that safely transfer the film between each stage of processing before delivery onto a flat receiving tray located at the exit of the dryer.

Range of PCB Processor available:

Wide Track PCB Processor range, offering 140 and 200 cm processing width.
Processing capacity: 80cm / min processing capacity @ 40 sec Dev Time.

The NG Processor is available in 35, 56, 66, 80, 95 and 110cm process widths.
Available in NG and NGs formats that offer a choice of production speeds: -

• NG: 82cm / min processing capacity@ 30 sec Dev Time
• NGs: 115cm / min processing capacity@30 sec Dev Time

In Offline (manual loading table) or online format (auto loading) to support all major PCB Film Plotters available on the market.

Accesories

COLENTAMC Chemical mixing, transfer & storage console
The MC is a multipurpose semi-automatic device for accurately mixing chemical concentrates with water, for transferring mixed chemistry into the processor tanks and to store replenishment solutions that connect directly to the processor replenishment pumps without the need for additional storage tanks.

COLENTA Silver recovery system Silverfit 40
An automated system used to recover silver from the waste Fixer solution before disposal or re-use, suitable for NDT, PCB and Medical Imaging applications.

COLENTA Easy Clean cleaning products
A specialized range of liquids designed to help operators keep their processor clean and in good operating condition.

COLENTA water panel assembly
Including filter, flow meter, thermometer and pressure gauge. Supporting 2 water outlets, one to be used for supplying wash/cooling water to the processor and one additional outlet for use during service, cleaning and chemical mixing procedures.

COLENTA PC monitoring software
When installed onto a PC, will allow the processor status and working parameters to be monitored remotely.

Download NG Processor Brochure

Download NG Processor Datasheet

Download Wide Track PCB Processor Brochure

Download Wide Track PCB Processor Datasheet

KODAK films have been developed exclusively for PCB applications using advanced techniques that came directly out of KODAK's century of image experience. Twenty-five years ago, KODAK invented the nucleated emulsion tchnology that has proven so valuable and effectivein PCB manufacturing and they have continued to improve  that technology ever since.

APR7 Film uses the latest Integrated Booster Technology (IBT) processing technology pioneered by KODAK. APR7 Film is specifically designed for PCB photo-tool creation, and pre-conditioned by Kodak in a clean-room environment to make it "ready to use" right out of the box.

Download APR7 Films Brochure

AIM7 provides hard, high quality line edges and good dimensional stability. It is suitable for lines and spaces as small as 1 mil and photoplotter resolution settings as high as 12,000 DPI. It has a fast-developing time and excellent resistance to photo abrasion and physical wear.

Download AIM7 Films Brochure

KODAK Processing Chemicals have been specifically developed and manufactured to meet the most demanding PCB requirements.

• Date stamps ensure freshness
• Color coded caps and labels make for easy identification
• Safety seals on bottle tops deter from tampering

ACCUMAX Rapid Access Developer and Replenisher (CAT No. 6620009), has been improved for cleaner-working performance. This high-performance rapid access developer, for use with KODAK ACCUMAX and PRECISION LINE Films, is concentrated and dilutes 1:2 for all applications. Lightweight 5 L plastic bottles are easy to handle for mixing replenisher and filling the processor. Bottles are designed for cleanroom environments used in the PCB applications. Manufactured in ISO registered facilities to the highest quality specifications. Bottles are stamped with a 2-year expiration date to ensure consistent quality.

KODAK Rapid Fixer and Replenisher (CAT No. 6620017), has been improved for cleaner-working performance. This high-performance rapid access fixer, for use with KODAK ACCUMAX and PRECISION LINE Films, is concentrated and dilutes 1:3 for all applications. Lightweight 5 L plastic bottles are easy to handle for mixing replenisher and filling the processor. Bottles are designed for cleanroom environments used in the PCB applications. Manufactured in ISO registered facilities to the highest quality specifications. Bottles are stamped with a 2-year expiration date to ensure consistent quality.

Download ACCUMAX Brochure

FALCON SERIES KEY FEATURES

Four Corner Alignment Lay-Up
Falcon is equipped with four sets of independently controlled GigE camera modules to perform quadrilateral deformation measurements of each PCB inner layer. The Lay-Up system uses the measurement results as a benchmark to adjust each inner layer to the best centre to achieve an ultra-high-precision layer to layer alignment. 

Lay-Up Accuracy: ±15um
The Lay-Up system not only provides high-precision PCB lamination Lay-Up, but also perform inner layer measurement and data collection. With this technology capturing deformation data through 2D measuring equipment with extra procedure is no longer required for panel study and NG panel filtering.

Dual Shuttle Tables Design
All Models of Falcon are equipped with Dual Shuttle Tables, which allows panel lay-up and welding to be processed at the same time allowing high productivity and maximized throughput.
Falcon S: Capacity 3300 Inner Layers Per Day
Falcon X: Capacity 6600 Inner Layers Per Day

Dual Machine Design
Falcon X is equipped with Dual Machine Design with 8 x GigE Industrial Cameras, 8 x High Frequency Electromagnetic Weld Controller, 4 x Shuttle Tables, 2 x Lay-Up Stations and 2 x Weld Stations. This allows one machine with the output of two machines and requiring only one operator.

Lay-Up Speed: 9~11 Seconds Per Layer

Highly Automated System
Falcon series system greatly simplifies the operation required for panel size adjustment and production. This effectively reduce personnel intervention in the production process. The equipment software provides unlimited numbers of configuration settings profiles, which allows for changing job in under 5 mins.

Intuitive User Interface
Falcon user interface is simple and easy to understand. The software is designed with a touch interface and multiple self-calculate algorithms allowing operator to do sophisticated job with very simple inputs. The software is designed with a modern UI, making it extremely fast for anyone accustomed to a smartphone or tablet.

Download Brochure

Lumiplas S.L., Spain is one of world’s leading company providing entire range of wet processing systems for the past three decades to customers in Europe. Lumiplas provides patented solutions for wet processing applications, including alkaline etching, acid etching, developing, horizontal metallization process (black hole, shadow, etc), chemical tin process, chemical silver process, film stripper, tin stripper, de-smear, high pressure chemical wash, dryers, etc. 
Process: Electrolitic tin process, Electrolitic silver process, etc.

Download Brochure

Kitagawa Seiki, Japan is a leading supplier of proprietary thermal, pressure, control and other advanced technologies vacuum press to develop and manufacture innovative, high-performance, high-quality PCB and CCL products.  

Kitagawa develops and manufactures press-related machinery for a wide range of applications including copper clad laminates, fabrication of printed circuit boards for use in mobile communications, home appliances, car electronics, and satellites. By developing and designing machinery and control systems to meet specific customer needs, we are helping to improve production efficiency.
 

PCB Pressing Equipment

CCL press Equipment

• Customised specifications to meet specific customer needs.
• Presses are subject to minimal age-related deterioration, ensuring consistent high-quality products over its life cycle.
• Proprietary technology minimizes strain, enabling production of higher quality products.
• No. 1 global market share for large vacuum presses for making CCL. 
   

Prepreg Cutting System

• Kitagawa Seiki's proprietary cutting technology reduces the flying of resin chips and prevents breakage of resin edges.
• Minimal possibility of damage due to cutting dust being carried over to the next process.
• Installation of an optional surface inspection unit enables detection of prepreg defects

Download Brochure