Products

With its fast, accurate, frequency-dependent transmission line modeling, the Si9000e is designed to model transmission line loss, impedance at given frequencies and extract full transmission line parameters over a wide range of popular PCB transmission lines (over 100 structures). The Si9000e extracts RLGC matrices and rapidly plots a range of transmission line information for the structure you are designing. Loss is graphed three ways with clear indication of dielectric, copper and total loss and from 2017 includes Hammerstad, Groisse and Huray methods for roughness modeling.

Main Features

• Links with Speedstack as Speedstack Si
• Si Crosstalk option – Multi line and differential pair (lossless) crosstalk – models coupling between traces
• Si Projects option with Speedstack saves structure groups
• Roughness modeling – Smooth / Hammerstad / Groisse / Cannonball-Huray
• Inbuilt impedance graphing
• Graphs conductor, dielectric and insertion loss
• At-a-glance comprehensive S-parameter charting – magnitude, phase and Smith charts
• Single-ended and Mixed-mode S-parameters charting and data tables
• User defined S-parameter source and termination impedance
• Frequency dependent modeling down to 1KHz
• Go / no go via stub check

Si9000e options 

• XFE option – provides crosshatch return path modelling for flex and flex-rigid PCBs 
• Si Crosstalk option – Multi line and differential pair (lossless) crosstalk – models coupling between traces 
• Si Excel Interface option – Microsoft Excel® interface option for lossless calculations in Si9000e 
• Si Projects option with Speedstack Si saves structure groups 

Download Si9000e Brochure

Polar Asia Pac in collaboration with Bogatin Enterprises LLC, USA can offer a comprehensive range of public classes and customised in-house training courses and programs to specifically suit your organisations human resources technical training needs.

Contact us for more details.

This two-day class, designed and offered by Signal Integrity Evangelist Dr. Eric Bogatin, shows you how to unlock the power of S-Parameters for signal integrity applications. This class enables you to tap into the secrets locked inside S-Parameters and walks through the details of interpreting the measured or simulated results of 1-port, 2-port, or 4-port S-Parameters as single ended, differential in the frequency domain and the time domain.

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This one-day class shows you how to design power distribution networks including board stack up, capacitor selection and mounting design. There are many myths associated with power integrity: just use 3 capacitors per pin, use as large a capacitor value as you can, stack capacitors on top of each other to get them closer to the device, or use short surface traces from the capacitor to the power pin. The way to separate myth from reality is by putting in the numbers. A key feature of this class is illustrating how to apply analysis tools such as rules of thumb, approximations, SPICE and 3D field solvers to provide guidance in achieving first time success. More..

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High Speed communication link designs are becoming ever more challenging. The fast pace development of semiconductor and IC technology combined with the ever increasing data rates have added to the challenge. Xpeedic’s High Speed SI solutions provide a fast and accurate way to model and simulate the discontinuities along the path and optimize channel performance.
 
SnPExpert – SnpExpert provides a quick way to understand the electrical characteristics of the passive interconnectors in a system by not only viewing the S-parameter in frequency domain but also examining them in time domain (TDR).

ChannelExpert – ChannelExpert provides a fast and accurate way to address the signal integrity issues arising from cascaded network of S-parameter blocks and TML models. It’s frequency domain cascading technology and 2D-RLCG full wave transmission line solver enables quick and accurate channel simulation.

ViaExpert – ViaExpert provides a fast and accurate way to simulate via structures for both pre-layout and post-layout scenarios. The built-in connector footprint database allow users to quickly assemble the via model with connector footprint, breakout region trace, for a given stackup.  

Dr. Ransom Stephens, Ph.D. is the author of over three hundred articles in the electronics industry, science journals and magazines on subjects ranging from the analysis of electrodynamics in high rate digital systems to fiber optics to quantum physics. As a research physicist and professor, he worked on experiments at universities and laboratories across the US and Europe making precise measurements of messy signals.

After being awarded tenure, he shifted to private enterprise where his expertise in signal integrity analysis of electrical and fiber optic systems. Led to new jitter measurement techniques and methods for extracting signals from noise. He has served on the electrical working groups for several high data rate standards including PCIe and OIF CEI. Ransom is an entertaining teacher with a legendary reputation for delivering a clear understanding of complex topics. 

Find out more here.

Atlas for Anritsu VNA is compliant with IPC TM650 2.5.5.12 (Test Methods to determine the Amount of Signal Loss on Printed Boards) and provides support for Delta-L methodology.

Atlas Si is a high precision insertion loss measurement package designed specifically for PCB fabricators and OEMs. It provides accurate, repeatable measurements of frequency-based transmission line losses, allowing fabricators to meet stringent targets that maintain signal integrity within the limits of the latest high-speed chipsets.

Polar has partnered Anritsu for integrating their Anritsu ShockLine™ 4-Port Performance VNA (vector network analyzers) with Atlas. Anritsu ShockLine™ 4-Port Performance VNAs achieve a new level of capability, flexibility, and value for RF and microwave network analysis applications delivering excellent performance for measurements from 50 kHz up to 43.5 GHz. These instruments are ideal for testing passive and many active components with general purpose VNA requirements. The ShockLine family employs advanced Anritsu technology and design expertise to attain outstanding dynamic range, calibration and measurement stability, and speed performance in efficiently packaged, compact, and robust VNA instruments.

Anritsu ShockLine™ 4-Port Performance VNA Key Features and Benefits

• Time domain with time gating option enables easier and faster fault identification in broadband devices
• Patented non-linear transmission line (NLTL) technology delivers wider bandwidth and higher dynamic range than competing technologies, enabling better measurement accuracy and repeatability with longer intervals between calibrations
• Multiple calibration methods to choose from to best suit your application – SOLT, SOLR, SSLT, SSST, LRL, LRM, or Thru update
• Precision AutoCal™ or SmartCal™ for an easy, one-button automatic method of VNA calibration
• Eliminates the need for over-specified, high-end VNAs with extra features not required for production testing
• Anritsu’s Extended-K^TM connectors enable ShockLine frequency option 43 VNAs to offer guaranteed performance to 43.5 GHz in a K/2.92 mm compatible form factor

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_{Note: Anritsu Corp., USA are the sole owners of following trade marks for ShockLine™, AutoCal™, SmartCal™ and Extended-K^TM}

Polar Atlas software enables PCB fabricators to test PCB transmission line losses in a tightly controlled production environment. Atlas employs mathematical processing techniques* to extract frequency dependent loss characteristics when used in conjunction with suitably designed test coupons and Atlas precision GHz probe assemblies.

Atlas packages interface either with industry standard Tektronix DSA8300 or DSA8200 oscilloscope TDRs. Fabricators can choose to add Atlas to their existing Tek DSA or alternatively Polar can supply a turnkey package.

Atlas supports multiple test methods including Delta-L, Delta-L 3 Line, SET2DIL (Single-Ended TDR to Differential Insertion Loss) for extraction of differential insertion loss and effective Er from a single ended test and suitably designed coupon, SET2SEIL method (Single-Ended TDR to Single-Ended Insertion Loss) for single ended insertion loss testing and SPP (Short Pulse Propagation) methods as called for in IPC-TM-650

Main Features

• Atlas software is designed to assist PCB fabricators in the accurate and repeatable measurement of PCB transmission line losses in a PCB production environment.
• Ergonomic probe housing:
•  Tracks system risetime and monitors the system bandwidth.
• Delta-L - Atlas supports the Delta-L technique (v16_04 fully incorporates rev2p31 of Delta-L with the current settings and parameters) which uses long-line short-line measurement combined with innovative via de-embedding techniques, Delta-L provides a sound method for removing the via effects from differential (mixed mode) s-parameters when characterizing raw PCBs for insertion loss.
• SET2DIL/SET2SEIL - Atlas test methods also include both the SET2DIL (Single-Ended TDR to Differential Insertion Loss) and SET2SEIL (Single-Ended TDR to Single-Ended Insertion Loss) test methods for extracting differential insertion loss from single ended measurements.
• SPP – Short Pulse Propagation  - SPP allows extraction of PCB electrical characteristics that impact signal propagation; it uses your existing TDR/TDT equipment and produces frequency dependent parameters such as the propagation constant (alpha, attenuation and beta, phase constant) and effective dielectric constant along with the characteristic impedance (including even and odd mode impedance.) Atlas measurements include launch point extrapolation/long line regression fit.
• Controlled impedance test - Atlas GHz test software is also capable of traditional lossless controlled impedance test

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The Si8000m is a boundary element method field solver that builds on the familiar easy to use user interface in earlier Polar impedance design systems. The Si8000m adds enhanced modelling to predict the finished impedance of multiple dielectric PCB builds and takes into account the local variations in dielectric constant on close spaced differential structures. The Si8000m assumes negligible insertion loss in the transmission line. The Si8000m field solving impedance design system offers advanced field solving methods to model most circuit designs and is totally complementary to the CITS880s and RITS550/880 manual and automatic Controlled Impedance Test Systems.

Main Features

• Powerful impedance design system
• Impedance Goal seeking
• Model multiple dielectric PCBs
• 16 Single ended structures
• 27 Differential structures
• 36 Single ended coplanar structures
• 36 Differential coplanar structures
• Reduce time to market
• Graph production variations
• Single ended and differential modelling
• Calculate the effect of resin rich areas
• Enhanced soldermask models
• Optional track resistance calculator

Si8000m options

• XFE option – provides crosshatch return path modelling for flex and flex-rigid PCBs
• Si Crosstalk option – Multi line and differential pair (lossless) crosstalk – models coupling between traces
• Si Excel Interface option – Microsoft Excel® interface option for lossless calculations in Si8000m/Si9000e
• Projects option with Speedstack saves structure groups

Download Si8000m Brochure

UcamX Pro+ is Ucamco’s latest generation of CAM software for the Rigid, Flex and HDI PCB manufacturing industries. It takes advantage of modern-day multicore and 64 bit workstation technology to set new standards in performance and throughput, and comes with a clever and highly intuitive new user interface that adapts itself functionality-wise as a job progresses through the CAM workflow.

It captures not just layout data but also netlist information, customer specifications, mechanical drawings and manufacturing rules in a single smart engineering database. UcamX Pro+ deploys powerful automatic security tools to detect accidental operator errors. UCamX Pro+ outputs fully-automated machine-optimized tooling for all industry-standard electrical testers and AOI systems, photo plotters, drilling and routing equipment and direct imagers. It is delivered ready-automated with built-in dynamic functionality for a fast roll-out and a fully customized smart workflow. Labor-saving functions include automated board structuring, netlist and test-point generation without manual intervention, & dynamic yield-driven auto-panelization.

Main Features

• YELO Automatic DfM Adjuster
• Tombstone and Solder Escape Prevention
• Secure Etch Compensation with Horns
• 64 Bit, Multi-Core Parallel Processing
• Zero-defect tooling
• Out-of-the-box CAM productivity
• 100% integration into existing environment
• State-of-the-art intuitive user interface
• Wait times on complex algorithms slashed by up to 500% (8-core)
• Top-notch performance by using parallel processing on today’s multicore processors
• High-level automation – without limits

More details here

Multi Job Panelizer is a stand-alone software application to combine different single PCBs into high-yield production panels. It optimizes base material utilization while minimizing the number of different panel layouts and production batches entering the shop floor. Its modular concept and scalability make it the perfect tool for interactive as well as for 24/7 fully automated and unattended use. Multi Job Panelizer blends in naturally with any existing CAM environment, whether from Ucamco-or from a third-party software supplier.

As an interactive tool, Multi Job Panelizer features an easy-to-use PCB placement interface, with neatly designed and intuitive function buttons, backed up by pleasant keyboard shortcuts. Various plug-ins for real-time panel analysis and optimization provide visual feedback during operation and guarantee unparalleled throughput and efficiency during the manual layout of a multi job production panel.

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CITS880s system is the 9th generation impedance test system from Polar Instruments Ltd, UK. It is a solution for fabricators who need to measure impedance on fine traces and thin copper. CITS880s features Launch Point Extrapolation (LPE) that extrapolates the TDR response to a point close to the start of the transmission line effectively aloowing users to measure the instantaneous or incident impedance of the line more acccurately.

In addition to the LPE the CITS880s is also capable of measuring shorter traces - typically 2-3 inches shorter than previous generation of the CITS series. CITS880s now ships with completely re-engineered IPS and IPDS high speed probes whcih reassuringly are precision moulded with ESD dissipative materials to give maximum protection to your CITS.

Polar IPS and IPDS high speed probes are specifically desgined for CITS880s. They combine revised internals with more robust mechanical design and enhancements to the signal path, along with ergonomic precision mouldings in 100% ESD dissipative materials. IPS and IPDS probes are easily identified and contrast with previous generation probes by the use of the blue labels and blue resists on the probe tip interface.

Click here to see what's new in the CITS880s.

Speedstack PCB stackup design tool is a packaged combination of the Si8000m field solving impedance calculator and the Speedstack professional layer PCB stackup design system. It allows both impedance calculation and layer stackup/build up documentation.

For PCB fabricators, Speedstack PCB interfaces with the industry standard Polar Si8000m PCB Controlled Impedance Field Solver. It includes a link and license for Polar’s Si8000m, using the proven Polar Si8000m multiple dielectric boundary element field solver to provide the impedance data for the stack.

Ideal for both rigid and flex-rigid stackups

Speedstack PCB allows OEM designers to create accurate and efficient rigid and flex-rigid PCB stackups in just a few minutes, with error-free documentation for tighter control over the finished board. For PCB fabricators, Speedstack PCB provides the flexibility to quickly calculate the impact of substituting alternative materials to improve manufacturability and reduce cost while maintaining the specified parameters and performance of the board. The Navigator provides a clear contextual view of the rigid and flexible stacks within a flex-rigid build and allows easy alignment of displayed materials between stacks.

Speedstack PCB can be used when modelling and documenting mesh/crosshatch ground. Structure data and mesh geometry can be readily shared between Speedstack and the field solver. The associated technical report also supports different materials on the same dielectric layer, improving the clarity of documentation between the stackup designer and fabricator.

Download Speedstack PCB Brochure

Speedstack Flex flex-rigid PCB stackup design tool allows PCB fabricators and OEM engineers to create and document flex-rigid PCB layer stackups using the Speedstack family of PCB stackup design tools.

It allows OEM designers to create an accurate and efficient flex-rigid PCB stackup in minutes, with error-free documentation for tighter control over the finished board. On the other hand, for PCB fabricators, Speedstack Flex provides the flexibility to quickly calculate the possible impact of substituting alternative materials to improve manufacturability and reduce cost while maintaining the specified parameters and performance of the board.

 Main Features

• Mesh / Crosshatch ground planes
• Internal Coverlays
• Doublets - provides for situations where two or more flexi cores are present with an air gap in between.
• Definable colours per material
• Powerful stack browser / search option
• High quality error-free documentation

XFE Cross Hatch Flex Enhancement

Polar has produced an alternative approach to modeling crosshatch using a proprietary technique, XFE (Crosshatch Flex Enhancement) this technique uses Polar's 2-D field solvers but uses a unique algorithm to correct for the effects of flex over a wide range of typical controlled impedance structures.

This approach has enabled solvers to model more closely the effects of a wide variety of crosshatch geometries. The XFE option, applicable to both Polar’s Si8000 lossless transmission line impedance solver and to the lossless mode of the Si9000 frequency dependent, lossy transmission line field solvers allows for configuration of hatch pitch (HP) and width (HW) as shown in the above graphic

Main Benefits of XFE

• Reduces prototype turns when producing impedance controlled flex PCB
• Provides modeling for controlled impedance lines with crosshatch or mesh ground returns
• Modeling is based on proven Polar BEM solver
• Available as an option for Si8000m and Si9000e for all lossless transmission lines
• Useful for any PCB type deploying meshed / crosshatched return planes e.g. interposers

Ucamco's iamcam automates PCB front-end tasks and integrates business systems. This cuts the error rate and the need for operator intervention. It is, by all standards, an exceptional answer to the daily challenges of front-end and production professionals who need to increase quality, reduce errors and drive cost out of the processes. It enables unparalleled workflow automation with rock solid quality control.

iamcam is highly scalable and serves as the heart of any size front-end production operation. It can be configured for simple two to four-layer prototype shops, as well as for the most advanced HDI jobs, sequential build, backdrill, flex-rigid.

Main Features

• Seamless integration with 3rd party systems
• Compatible with your incumbent CAM system
• Web-based client/server front-end software
• Avoid most human errors with comprehensive range of automated DfM checks
• Increase efficiency & throughput
• Save time & money

Ihara Electronics Co. Ltd, Japan presents ACCULINE II a truly portable, light weight, battery operated, digital line width and spacing measurement system. ACCULINE's built in color LCD display allows operators to make quick, accurate and repeatable measurements for top and bottom line width and spacing for fine line single ended and differential controlled impedance traces.

ACCULINE II is a high performance and reliable product which utilizes advanced micro computer technology and color LCD image sensor to ensure superior performance and measurement reliability. It is a battery-operated tool offering a truly portable unit that makes operation easy at any location including dark rooms with low visibility. The large LCD displays real line images that can be transferred to a PC, using a USB port, for further analysis.

Usually operators rely on skill to make measurements using a microscope and this can result in varied results for different operators. ACCULINE's automated measurement algorithm provides accurate and repeatable results in its place.

Download ACCULINE Brochure

UCAMCO offers a range of photo plotters which are renowned for their high accuracy, throughput and reliability. Available in a choice of “drop-in” models for customers who want the highest plot speed, or the finest features (down to 5 micron), or the best all- round combination of speed, resolution and price. With its unique optical system you can plot the tightest tolerance designs with pin sharp quality. Multiple plot resolutions deliver the optimum setting for every image. UCAMCO’s unique imaging functions, syntectic modulation and submicron pixel placement, eliminate the rounding errors found on conventional plots and guarantee optimal line width accuracy. Dynamic beam positioning and the patented stress free film loader ensure an unrivalled geometric accuracy on every plot for perfect side to side registration.

UCAMCO Photo plotter are available in various throughput and fine-line capability models to best suit our customer’s photo tooling production needs. 

• Phoneix-xP Series

  • Download Brochures for Phoenix-xP Series

• SilverWriter Series 

  • Download Brochure for SilverWriter 8850 P and 8000 HD

• Large and Extra Large Format Series 

  • Download Brochure for Hawk and Condor photoplotters

CGen Coupon Generator reduces the time-consuming process of creating impedance coupons manually to just a few minutes, adding powerful new features that give coupon generation new levels of control and flexibility.
CGen PCB Coupon Generator is an automatic impedance coupon generator that allows you to create a controlled impedance test coupon from scratch or import finished stacks from Speedstack PCB and Speedstack Si or structures from the Polar Si8000 and Si9000 field solvers.

CGen Si incorporates all the features of CGen PCB and adds insertion loss coupon capability. Please note designs for insertion loss coupons need to be fine-tuned to OEM requirements and final adjustment of launch and via structures may still be required. If in any doubt – please check with your design authority.

Replacing scripted coupon generation

CGen replaces time consuming manual or scripted coupon creation with a simple four-stage process:

• Import or create coupon layer stackup and impedance structure
• Select coupon and impedance test probe
• Edit and preview changes in real-time
• Export Gerber and drill files

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ChannelExpert provides a fast, accurate and easy way to evaluate and analyze pre-layout or post-layout high speed channel with its built-in advanced circuit and EM solver technologies.

It is challenging for digital system designers to simulate a high-speed SERDES channels. There are many different simulation scenarios to cover ranging from pre-layout / post-layout, frequency-domain / time-domain / statistical analysis, compliance check, to TX / RX optimization. 

ChannelExpert offers many built-in channel templates to support pre-layout exploration. Parametric S-parameters and transmission line models are supported for easy channel exploration. For post-layout scenario, ChannelExpert can extract the desired channels with or without crosstalk from physical layout with transmission line and 3D via models automatically generated with inbuilt field solvers.

Key Features

• Built-in 2D RLGC solver to model TML
• Easy multiple channel creation by table with only one-click
• Built-in template to quickly create single channel and multiple channel
• Easy to import PCB file to create channel
• Support full BP simulation for Traditional BP, Orthogonal Direct BP, Orthogonal Mid-Plane BP
• Support generating high speed SERDES channels from a bunch of PCB files and perform crosstalk and insertion loss simulations
• Support buffers with DFE, CTLE and FFE, automatically optimize the equalization coefficient based on channel characteristics
• Built-in substrate and stackup databases to modeling TML
• Parametric S-Parameter files and transmission line physical parameters for easy channel exploration
• Add multiple interpolation and extrapolation algorithms for S-parameter based frequency domain and crosstalk analysis
• Support COM (Channel operation margin) analysis
• Seamlessly link to SnpExpert for S-parameter viewing and post-processing

Download ChannelExpert Brochure

The Colenta NG - PCB Film Processor is a fully automatic “dry to dry” processing system designed to provide consistent high-quality film production for the range of PCB films commonly used in the industry. The processor design incorporates a non-opposed, submersed roller transport system with minimal contact to the film emulsion and with intermediate wash water crossovers that safely transfer the film between each stage of processing before delivery onto a flat receiving tray located at the exit of the dryer.

Range of PCB Processor available:

Wide Track PCB Processor range, offering 140 and 200 cm processing width.
Processing capacity: 80cm / min processing capacity @ 40 sec Dev Time.

The NG Processor is available in 35, 56, 66, 80, 95 and 110cm process widths.
Available in NG and NGs formats that offer a choice of production speeds: -

• NG: 82cm / min processing capacity@ 30 sec Dev Time
• NGs: 115cm / min processing capacity@30 sec Dev Time

In Offline (manual loading table) or online format (auto loading) to support all major PCB Film Plotters available on the market.

Accesories

COLENTAMC Chemical mixing, transfer & storage console
The MC is a multipurpose semi-automatic device for accurately mixing chemical concentrates with water, for transferring mixed chemistry into the processor tanks and to store replenishment solutions that connect directly to the processor replenishment pumps without the need for additional storage tanks.

COLENTA Silver recovery system Silverfit 40
An automated system used to recover silver from the waste Fixer solution before disposal or re-use, suitable for NDT, PCB and Medical Imaging applications.

COLENTA Easy Clean cleaning products
A specialized range of liquids designed to help operators keep their processor clean and in good operating condition.

COLENTA water panel assembly
Including filter, flow meter, thermometer and pressure gauge. Supporting 2 water outlets, one to be used for supplying wash/cooling water to the processor and one additional outlet for use during service, cleaning and chemical mixing procedures.

COLENTA PC monitoring software
When installed onto a PC, will allow the processor status and working parameters to be monitored remotely.

Download NG Processor Brochure

Download NG Processor Datasheet

Download Wide Track PCB Processor Brochure

Download Wide Track PCB Processor Datasheet

Xpeedic SnpExpert provides a quick way to understand the electrical characteristics of passive interconnectors in a system by viewing the S-parameter in frequency domain and examining the time domain reflectometry (TDR). One-click definition of differential pairs and victim / aggressor setup, together with the built-in NEXT, FEXT, PSXT, ILD, ICR, and ICN, allows user to quickly evaluate the crosstalk.

Key Features

• One-click to define differential pairs and victim / aggressor pairs
• Built-in compliance metrics, such as IEEE802.3, OIF CEI etc.
• Built-in template plot for RF components
• Built-in Thru-Only De-embedding (TOD)
• Built-in Open-Short / Thru De-embedding (OTD) method for on-chip de-embedding
• Built-in delay & skew calculator
• Support multiple data curves gating with only one click and export S-parameter
• Built-in RLGC solver for transmission lines
• Multi-ways to extract Dk / Df from S-parameter file
• Built-in passivity / causality / reciprocity / stability checker
• Support to convert S-parameter to broad band spice or Hspice RFM model
• Support S->RLGC, RLGC->S, S->W-element transformation
• Support complex numbers for S-parameter
• Support to combine multiple s4p files to one snp
• Support for Touchstone 2.0
• Support Python script to invoke most SnpExpert features, including S-parameter import, plot, add mark, TDR, TOD and so on
• Easy to generate report in MS Word and PPT format

Download SnpExpert Brochure

FALCON SERIES KEY FEATURES

Four Corner Alignment Lay-Up
Falcon is equipped with four sets of independently controlled GigE camera modules to perform quadrilateral deformation measurements of each PCB inner layer. The Lay-Up system uses the measurement results as a benchmark to adjust each inner layer to the best centre to achieve an ultra-high-precision layer to layer alignment. 

Lay-Up Accuracy: ±15um
The Lay-Up system not only provides high-precision PCB lamination Lay-Up, but also perform inner layer measurement and data collection. With this technology capturing deformation data through 2D measuring equipment with extra procedure is no longer required for panel study and NG panel filtering.

Dual Shuttle Tables Design
All Models of Falcon are equipped with Dual Shuttle Tables, which allows panel lay-up and welding to be processed at the same time allowing high productivity and maximized throughput.
Falcon S: Capacity 3300 Inner Layers Per Day
Falcon X: Capacity 6600 Inner Layers Per Day

Dual Machine Design
Falcon X is equipped with Dual Machine Design with 8 x GigE Industrial Cameras, 8 x High Frequency Electromagnetic Weld Controller, 4 x Shuttle Tables, 2 x Lay-Up Stations and 2 x Weld Stations. This allows one machine with the output of two machines and requiring only one operator.

Lay-Up Speed: 9~11 Seconds Per Layer

Highly Automated System
Falcon series system greatly simplifies the operation required for panel size adjustment and production. This effectively reduce personnel intervention in the production process. The equipment software provides unlimited numbers of configuration settings profiles, which allows for changing job in under 5 mins.

Intuitive User Interface
Falcon user interface is simple and easy to understand. The software is designed with a touch interface and multiple self-calculate algorithms allowing operator to do sophisticated job with very simple inputs. The software is designed with a modern UI, making it extremely fast for anyone accustomed to a smartphone or tablet.

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Lumiplas S.L., Spain is one of world’s leading company providing entire range of wet processing systems for the past three decades to customers in Europe. Lumiplas provides patented solutions for wet processing applications, including alkaline etching, acid etching, developing, horizontal metallization process (black hole, shadow, etc), chemical tin process, chemical silver process, film stripper, tin stripper, de-smear, high pressure chemical wash, dryers, etc. 
Process: Electrolitic tin process, Electrolitic silver process, etc.

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Kitagawa Seiki, Japan is a leading supplier of proprietary thermal, pressure, control and other advanced technologies vacuum press to develop and manufacture innovative, high-performance, high-quality PCB and CCL products.  

Kitagawa develops and manufactures press-related machinery for a wide range of applications including copper clad laminates, fabrication of printed circuit boards for use in mobile communications, home appliances, car electronics, and satellites. By developing and designing machinery and control systems to meet specific customer needs, we are helping to improve production efficiency.
 

PCB Pressing Equipment

CCL press Equipment

• Customised specifications to meet specific customer needs.
• Presses are subject to minimal age-related deterioration, ensuring consistent high-quality products over its life cycle.
• Proprietary technology minimizes strain, enabling production of higher quality products.
• No. 1 global market share for large vacuum presses for making CCL. 
   

Prepreg Cutting System

• Kitagawa Seiki's proprietary cutting technology reduces the flying of resin chips and prevents breakage of resin edges.
• Minimal possibility of damage due to cutting dust being carried over to the next process.
• Installation of an optional surface inspection unit enables detection of prepreg defects

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Cushion materials are used during heat pressing. However, conventional paper cushioning presented several problems. For example, it could only be used once, and it couldn’t be automatically conveyed because it had to be used in several layers. Top Board, which was the industry’s first single-cushion material and was developed by Yamauchi in 1960, has solved these problems. And now, with the addition of YOM (Yamauchi Original Mat), which exceeds the performance of Top Board, the lineup is even larger. As a leading company for single cushion materials, Yamauchi is meeting the diverse needs of all industries.

YOM (Yamauchi Original Mat) can be re-used hundreds of times at various press machine and lamination machines. In addition to saving costs, environmental friendliness is achieved by reducing waste. It is constructed by glass-fiber cloth and FRR (Fiber Reinforced Rubber) by fluorine rubber with keeping constant pore.

Main Features

• Single Cushion Materials and Top Board Have Boosted the Heat Press Productivity
• Introducing the YOM (Patented) with Enhanced Performance That Surpasses Even Top Board
• Combine Optimal Materials to Match Usage Conditions

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